3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications Revision:SEMI 3D23-0721 - Current like chunks

like chunks

orgで入手可能となる。初版は1993年発行。前版は2004年11月発行。

Endpoint protection

この仕様は，生産用ウェーハ仕様としては意図していない。

3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications Revision:SEMI 3D23-0721 - Current like chunksThe purpose of this Specification is to establish basic physical dimensions for the glass carrier intended to be used for panel level package processing. This Specification specifies physical dimensions of the glass carrier for use in panel level packaging (PLP) applications.<br><br>This Specification describes glass carrier with 510 mm 515 mm and 600 mm 600 mm panel sizes as specified by the relevant SEMI 3D20. Referenced SEMI Standards (purchase