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G07300 - SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法 StdPbc-0624 The committee is continuing work

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Description

The committee is continuing work on improvement of specifications and procedures

2  This Specification applies to all semiconductor manufacturing equipment that supports the data acquisition interface defined in the SEMI Specification for Data Collection Management

• Description of the specification conventions used

the feedstock for growing semiconductor grade single crystalline silicon (c-Si) as well as silicon wafers

G07300 - SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法 StdPbc-0624 The committee is continuing workglobal Assembly and Packaging Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1997200411 Referenced SEMI Standards None.

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