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G07700 - SEMI G77 - Specification for Frame Cassette for 300 mm Wafers Revision:SEMI G77-0699 (Reapproved 0215) - Superseded SEMI M53-1103 (technical revision)

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Description

SEMI M53-1103 (technical revision)

SEMI C28-0618 (technical revision)

This Standard was technically approved by the HB-LED Global Technical Committee

and monolithic integrated gas systems

G07700 - SEMI G77 - Specification for Frame Cassette for 300 mm Wafers Revision:SEMI G77-0699 (Reapproved 0215) - Superseded SEMI M53-1103 (technical revision)1 Purpose 1. 1 This Standard specifies the mechanical features for a 300 mm wafer frame cassette used between the wafer mounting process and the die bonding process. 2 Scope 2. 1 This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. 2. 2 Only the physical interfaces for the frame cassette are specified; no materials

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