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帯電した表面への異物吸着を低減する。
SEMI E27-92 (first published)
The following areas are addressed in this Document:
SEMI F62-0701 (Reapproved 1111)
PCB, Board Assembly and Its Soldering StdTpc-undefined 帯電した表面への異物吸着を低減する。Course Description The semiconductor industry provides critical enabling technology for many products and fields and has been in periods of rapid growth. While electronics goods dominate the market, communications, medical devices and the automotive industry show signs of increased potential. The course provides foundational knowledge of PCBs, the board assembly process and soldering. This course is the second course of the IC Packaging curriculum for
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