ViaGasaFamido Phone Chip Conduction Wire Non Insulation 120m Mobile Phone Motherboard Fingerprint Jump Welding Copper Soldering Jump Wire for PCB BGA Welding Repair (0.01mm) LiunxDromic requiring minimal maintenance for the

requiring minimal maintenance for the years ahead

Since the beginning

EAN: 5060529682939

making installation just a piece of cake

ViaGasaFamido Phone Chip Conduction Wire Non Insulation 120m Mobile Phone Motherboard Fingerprint Jump Welding Copper Soldering Jump Wire for PCB BGA Welding Repair (0.01mm) LiunxDromic requiring minimal maintenance for theExcellent Flexibility: With a fine diameter and minimal jump wire, this soldering pure copper conductor wire is easy to straighten and less likely to break. Its exceptional flexibility allows for straightening without bending, and can even be further straightened down to smaller sizes. Accurate Connectivity: Featuring an super fine diameter design, the phone fingerprint repair jump wire ensures accurate connections, effectively preventing short